Partners from across Europe met online on October 3, 2025, to review progress in Work Packages 1 and 2, which focus on curriculum alignment and course development within the RESCHIP4EU Master’s in Embedded Systems Design.
The meeting focused on:
• Ongoing coordination of curriculum updates and program structure
• Ensuring country-specific educational needs are reflected in course design
• Organizing content areas around security, reliability, and embedded AI
• Exploring naming options for the upcoming COCAM module
• Addressing technical aspects of digital learning delivery on the Icarus platform
Participants reaffirmed their shared goal of developing an innovative, industry-relevant Master’s program that bridges academic excellence, practical skills, and Europe’s strategic priorities in chips design.
Learn more about RESCHIP4EU: https://www.eitdigital.eu/eu-collaborations/reschip4eu/
Project Number: 101158828 — RESCHIP4EU — DIGITAL-2023-SKILLS-04
Disclaimer: Co-Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or HADEA. Neither the European Union nor the granting authority can be held responsible for them.